Applications for flexible hybrid electronics in aerospace and defense exist in environmental monitoring, biomedical assessment, security, communications, energy generation and storage, computation, supply chain management and asset sustainment.
The COVID-19 pandemic clearly proved challenging to the manufacturing industry in myriad ways. Now, as nations and industries begin to navigate their way forward as restrictions are lifted, manufacturers have an opportunity to put into practice some lessons learned.
Many industries have been making parts with micron dimensions for some time, but in the last few years, the market for miniaturization has expanded. The demand is not only for small parts, but also for small complex features on larger parts. This is due chiefly to the switch to modules in which the functions of several parts or subsystems are not handled by a single complex unit.
Purdue University’s College of Engineering is partnering with MediaTek Inc., a leading global fabless chipmaker, to open the Midwest’s first semiconductor chip design center, to be housed on Purdue’s campus.
President Biden's $15.5 billion investment drives a clean energy revolution, revitalizing auto manufacturing and accelerating the electric vehicle transition.
Ultimately, the best way to improve semiconductor packaging may be to eliminate the traditional package altogether.
Tooling U-SME proves the most helpful training to Iowa’s Rosenboom because employees learn things online that are immediately applicable.
As manufacturers embrace the “new normal,” advanced technologies will set organizations apart from the field.
The experience an Italian electronics manufacturer had with emerging tools provides a glimpse of a better world.
The three keynote speakers of HOUSTEX, EASTEC, SOUTHTEC and WESTEC—the Manufacturing Technology Series—offer perspectives pertinent to manufacturers in general, but of particular use to small and medium-sized manufacturers.
